HAST and burn-in design in CAD tools for semiconductos and other applications

HAST BOARD DESIGN GUIDELINES THB and HAST board DESIGN THB (Temperature Humidity Bias) and HAST (Highly-Accelerated Stress) Test boards are used to qualify device packages. These tests are used to evaluate the reliability of non-hermetic packaged devices in humid environments. There are important guidelines that must be followed when designing these types of Burn-In Boards to prevent premature failures in this harsh environment. Below Read more…


HAST Chamber

The most common types of reliability tests for semiconductors are; burn-in, power temp cycle (PTC), and HAST. Burn-in Burn-in tests check the reliability of the semiconductor device and are typically done at 125ºC or 150ºC, while electrical signals and power are applied to ASICs. Burn-in boards are put into the burn-in system which supplies the necessary power and stimulus to the samples while maintaining Read more…


KES Systems a leader in burn-in technologiesexhibits at Photonics WEST

KES Systems, a world leader in burn-in technologies,  WLBI and SLT will be at Booth #5585 at Photonics WEST, The leading event for the photonics and laser communities.  Our high-power Hyperion LED tester can handle the highest power wafer-level burn-in challenges in the industry.   Visit our booth to learn more. Photonics WEST is at the Moscone Center in San Francisco and will be held Read more…

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