Semiconductor burn-in is a method for detecting early failures in semiconductor devices. This is also called, ‘infant mortality’. It requires the testing of devices under a set of stress conditions that usually involves an elevated temperature of 125° C to 150° C (commonly, some ‘high reliability” device can be tested at 200° C or higher) for a set number of hours. During that time Read more…

HAST BOARD DESIGN GUIDELINES THB and HAST board DESIGN THB (Temperature Humidity Bias) and HAST (Highly-Accelerated Stress) Test boards are used to qualify device packages. These tests are used to evaluate the reliability of non-hermetic packaged devices in humid environments. There are important guidelines that must be followed when designing these types of Burn-In Boards to prevent premature failures in this harsh environment. Below Read more…

The most common types of reliability tests for semiconductors are; burn-in, power temp cycle (PTC), and HAST. Burn-in Burn-in tests check the reliability of the semiconductor device and are typically done at 125ºC or 150ºC, while electrical signals and power are applied to ASICs. Burn-in boards are put into the burn-in system which supplies the necessary power and stimulus to the samples while maintaining Read more…

KES Systems, a world leader in burn-in technologies,  WLBI and SLT will be at Booth #5585 at Photonics WEST, The leading event for the photonics and laser communities.  Our high-power Hyperion LED tester can handle the highest power wafer-level burn-in challenges in the industry.   Visit our booth to learn more. Photonics WEST is at the Moscone Center in San Francisco and will be held Read more…